High performance thermal solutions
Hardware Spec.
| CPU Solution | |
|---|---|
| CPU Solution | Intel® Core™ i9/ i7/ i5/ i3 |
| Socket Solution | |
| Socket Solution | LGA1700 |
| Dimensions | |
| Dimensions | 89 x 89 x 45.8 mm |
| Material | |
| Material | Cu |
| Bearing Type | |
| Bearing Type | Ball and Sleeve |
| Capability (Watt) | |
| Capability (Watt) | 65W |
| Fan Speed (RPM) | |
| Fan Speed (RPM) | 4500 |
| Noise Level (dBA) | |
| Noise Level (dBA) | 42 |
| Life Expectancy (hrs) | |
| Life Expectancy (hrs) | 40000 |
| Weight | |
| Weight | 430g |
| Key Features | |
| Key Features | LGA1700 CPU cooler, RoHS |
Ordering Information
| 19100-000323-00-RS | SJC8;COOLER MODULE;HEATSINK:72*70*25.5mm,FAN:70*70*15.3mm;LGA1700,65W;STANDARD;00;HF-SETT-5Q472-1700;CU SKIVING+SCREW SET*4+GREASE+BRACKET SET;DC FAN:12V,4500RPM,2543-4P,L=220mm;EVERCOOL;R127015DUAF783bR;CCL;RoHS |
|---|


沪公网安备 31011202005249号