» 6th/7th Gen Intel® Core™ processor platform with Intel® H110 chipset and DDR4 memory
» Support dual display VGA+HDMI™
» On-board internal power connector for providing power to add-on cards
» Great flexibility for hardware expansion
Hardware Spec.
| Form factor | |
|---|---|
| SBC Form Factor |
|
| I/O Interface | |
| I/O Ports |
|
| Expansion Slots | |
| Expansion Slots |
|
| System | |
| Cooling method / System Fan | Fanless |
| Drive Bays | 2 x 2.5” SATA 6Gb/s HDD/SSD bay |
| Indicator&Buttons | |
| Buttons |
1 x Power Button 1 x Reset Button 1 x AT/ATX Switch |
| Physical Characteristics | |
| Construction | Extruded aluminum alloys |
| Color | |
| Color | Dark silver purple + Silver |
| Dimensions | |
| Dimensions | 132.6 x 255.2 x 190 (WxDxH) (mm) |
| Weight | |
| Weight | 4.2 kg/6.3 kg |
| Environment | |
| Operating Temperature |
i7-6700TE -20°C ~ 50°C with air flow (SSD) i5-6500TE -20°C ~ 60°C with air flow (SSD) |
| Humidity | 10% ~ 95%, non-condensing |
Ordering Information
| TANK-870e-H110-i5/4G/3B-R12 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 1 x PCIe by 1 & 1 x PCI expansion, VGA/HDMI, 9~36V DC, Powder paint, RoHS |
|---|---|
| TANK-870e-H110-i5/4G/3A-R12 | Ruggedized Fanless embedded system with Intel® Core i5-6500TE 2.3GHz, (up to 3.3 GHz, 4-Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCI expansion, VGA/HDMI, 9~36V DC, Powder paint, RoHS |
Package Contents
| Package Content |
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